Circuits Assembly Online Magazine - 01005: Size Does Matter
WEBFeb 2, 2015 · The smallest component currently in use is known as an 01005. This is a passive component (resistor, capacitor) possessing extremely small weight and dimensions (FIGURE 1). The device is almost invisible to the naked eye. Its dimensions are 0.4mm in length by 0.2mm in width, with a height that varies …
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WEBWASHINGTON – Global semiconductor industry sales hit $51.3 billion in July, an increase of 18.7% compared to the July 2023 total of $43.2 bi... BANGKOK – Cal-Comp Electronics reported sales of $975.1 million for the second quarter, a decrease of 10.6% from the same quarter last year.... ROSHEIM, FRANCE – French electronics manufacturer ...
Neways to Construct EMS Factory in Slovakia - Circuits Assembly
WEBApr 12, 2022 · by Chelsey Drysdale. NOVA DUBNICA, SLOVAKIA – Neways said it plans to replace its two electronics manufacturing sites in Slovakia with one new 16,000 sq. m. factory, according to reports. The new site will focus on PCB, cable harnesses and cabinet production. The company says the facility will potentially grow to …
Circuits Assembly Online Magazine - Global Semiconductor …
WEBMay 14, 2024 · The global semiconductor manufacturing industry showed signs of improvement in the first quarter with an uptick in electronic sales, stabilizing inventories and an increase in installed wafer fab capacity, SEMI announced in its Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights.
Understanding 3D AOI, What It Is, and What It Isn’t - Circuits …
WEBDec 1, 2013 · Figure 5. The same part in 3D. Currently, AOI systems come with different levels of 3D coverage for components and solder joints. All 3D systems still offer 2D lighting and 2D inspection. It is for the AOI programmer or the QA department to decide to what extent they’d like to deploy new technology for quality assurance.
Clarifying Through-Hole Fill Levels - Circuits Assembly
WEBOct 22, 2019 · At present, through-hole joint fill requirements and inspection criteria are commonly identified and understood within the J-STD-001/IPC-A-610 specifications. Those indicate Class II/III assemblies should have at least 75% fill, based on the through-hole depth. An oblique angle view x-ray clearly shows the nature and depth of the fill ...
WEBThis amount was applied in the tin/lead experiment. For a no-clean, alcohol flux of 1.5 percent solids, the amount to apply on the test board is: Area board = 100 * 160 mm2 = 24.8 in2. Amount of (wet) flux per board = solid content flux * area * required amount dry flux = 100/1.5 * 24.8 * 0.0016 = 2.645 g.
Low-Temperature Solder: Challenges, Opportunities and …
WEBMar 1, 2024 · Low-temperature soldering (LTS) is a rapidly developing field with several potential benefits to the electronics industry. These benefits include reduced warping of components and substrates, lower energy consumption and reduced material costs. The lack of a standard solder alloy and the unique properties of emerging alloys, however, require development of new fluxes and processes for success.
IFC Considers $150M Investment in Salcomp India Expansion
WEBApr 5, 2024 · Salcomp Tech would use the funds to expand its manufacturing capacity in Chennai. The total project cost is $250 million and IFC is providing a seven-year loan up to $150 million to fund the project. Salcomp Tech is 100% owned by Salcomp Plc, a Finland-based holding company. Salcomp Plc is a wholly …
Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure ...
WEBJan 21, 2020 · How do LTS solders perform under thermal cycling and drop-shock testing? Several environmental, technology and reliability factors have recently combined to renew interest in the use of tin-bismuth-based solder alloys for motherboard manufacturing.
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