IEEE Electronic Components and Technology Conference (ECTC) being held May 27-30, 2025 at the Gaylord Texan Resort & ...

Over the past decade, the growth of passive components has been driven by smartphones. Faster communication and processing speed require more power consumption for smartphones, and therefore more ...

Computing accelerators grow more complex with multi-chip designs. TSMC plans to stack logic chips while integrating power ...

TSMC first GAA-based N2 process will enter HVM in the second half of 2025 with strong early adoption from both mobile and HPC ...

China has surged ahead of the U.S. in semiconductor research, publishing more than twice as many studies on chip design and fabrication in the past five years, a report reveals.

Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources ...

China possesses the key resources and technology that can significantly influence the American economy. Export restrictions ...

The underlying issue is closely linked to the end of Dennard scaling, a principle that once allowed engineers to shrink ...

TI has expanded its automotive portfolio with a high-speed lidar laser driver, BAW-based clocks, and a mmWave radar sensor.

Joining the trade war, launched by US President Donald Trump, China has suspended exports of many critical rare earth ...

TI launches a new automotive LiDAR laser driver, mmWave radar sensor, and BAW clocks, targeting improvements in vehicle ...

As the trade war between the US and China escalates, Beijing has suspended the export of several critical rare earth elements ...