This study discusses the integration challenges to scale down the Hybrid Bonding (HB) pad pitch [1], focusing on three pitches: 1um, 0.7um, and 0.4um. Alternative high-volume manufacturing (HVM) ...

abstract-The real data distribution of a specific category tends to approach a low-dimensional manifold in the Riemannian space, and the manifolds of different categories do not intersect in ...