Degradation in older chips can create new vulnerabilities; dealing with them involves some complex tradeoffs. The longer a ...

Arteris today announced the opening of a new engineering and customer support hub in Krakow, Poland. This new location will ...

Enables AI infrastructure providers to emulate and optimize all aspects of the data center, from the physical layer through the application layerValidates and ...

I last wrote about Nova (NVMI) as the Bull of the Day in September when shares were trading $200. I thought it was a key Semiconductor micro-player in the new AI revolution. Nova is a $6 billion ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped-out the world’s first HBM4 controller and PHY IP. This test chip was implemented using TSMC’s ...

However, these SoCs, often consumer-grade devices certified for automotive use, rely on full-featured operating systems that can compromise predictable and robust real-time performance. This trade-off ...

Using a heterogeneous version of Rent's rule, a design methodology for the global signal ... Wafer-level batch fabrication of chip input/output interconnects and chip scale packages provides new ...

The Bluetooth Low Energy 5.3 chip, developed by Renesas, not only cuts power consumption, but it helps lower an EV’s weight ...

Keysight Technologies and Coherent have collaborated on a 200G multimode technology demonstration that will be shown for the first time at OFC, in San Francisco, California 1st to 3rd April 2025.

Glass blowing is the conventional technique for manufacturing vapor cells, and while glassblowing can be used to ...

LPKF Laser & Electronics SE has joined Onto Innovation's Packaging Applications Center of Excellence (PACE) to accelerate the production of p ...