Large indigenous chip design companies can achieve better economies of scale that would give an edge with respect to the cost competitiveness of chips "Designing at 3nm is truly next-generation. We've ...

A new report suggests that Nvidia's B30, the successor to its China-exclusive H20, will feature multi-GPU scaling through ...

At the IEEE ECTC 2025 conference, imec highlights the exceptional performance and flexibility of its 300mm RF silicon ...

Xiaomi Chairman Lei Jun unveiled the company's debut in-house mobile SoC, the XRing O1, on May 22, calling it Xiaomi's "first answer sheet" in semiconductor design. Built on TSMC's second-generation ...

A wave of senior executives from global semiconductor giants such as Intel, AMD, and Texas Instruments (TI) are striking out ...

The Trump administration orders top US chip design software firms to halt sales to China, escalating tech tensions amid ...

Latency in relation to processors and performance is how long it takes for information to travel from A to B. The longer it ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Marvell Technology has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that ...

"Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud," said Will Chu, ...

Problems and solutions for improving performance with more data. Demand for new and better AI models is creating an ...

AMD acquired Enosemi to expand its photonics capabilities for next-gen AI systems. Deal's financial terms undisclosed. AMD stock up 3.38% premarket.