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Interesting Engineering on MSNUS engineers create topologically optimized heat exchanger for 27% better coolingThis 3D-printed heat exchanger ditches straight pipes for a more efficient internal design powered by advanced computation.
This chip also uses AMD's second-generation 3D V-Cache technology (thus the "X3D"), which boosts it for PC gaming for not much more cash than the standard Ryzen 9 9950X.
Now is the right time to evolve the model in ways that improve both financial sustainability ... That experience has stayed with me and shaped my thinking about what future corps members need. One ...
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