For bonding the radar housing, the task is simple: seal the housing and all of its contents, including the PCB and antenna, to the radome. Silicones are the most widely used materials for this.

Ideal for aerospace, defense, agriculture, automotive, industrial automation, and telecom sensors and video applications, its ...

IIT Madras and ISRO collaborate to develop SHAKTI-based semiconductor chip for indigenous microprocessor products with RISC-V technology.

Logical and physical optimization of DFT improves PPA.

Thomson Industries, Inc. has upgraded its online sizing and selection tool, making it easier than ever for motion system ...

Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing ...