Impulse relay turns on with an electrical impulse at the control input and turns off again with another impulse.

Thermal design has become a first-order constraint in GaN system performance. As GaN pushes deeper into high-power, ...

After three decades in broadcast engineering, Alan Jurison is moving to the world of wireless. He has joined Verizon as an RF design engineer in Syracuse. The veteran broadcast engineer worked for 13 ...

Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for ...

PITTSBURGH, April 23, 2025 /PRNewswire/ -- Through continued collaboration with TSMC, Ansys (NASDAQ: ANSS) today announced enhanced AI-assisted workflows for radio frequency (RF) design ...

In addition, Ansys and TSMC continue collaborating on design enablement for TSMC's next-generation A14 technology. To support the increasing demand for scalable electromagnetic analysis ...

To ensure reliable thermal management for the TSMC A16 process, Ansys ... and RF ICs. The flow automates device placement, routing optimization, and EM-aware tuning, while preserving design ...

This strategic acquisition aims to bolster Frontgrade’s Radio Frequency (RF) amplifier offerings, particularly to the aerospace and defense markets. Based in York, Pennsylvania, IDSI specializes ...

Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute ...

Abstract: This paper describes the design and performances of the first single band (2.6 GHz) dual receive and single transmit 50 Ohm front end module (FEM ... a three stage amplifier, a matching ...

This solves the low Q factor problem as there is no ON state resistance in this design ... other RF front end components, such as PA, LNA and transceivers, to dramatically reduce interconnect ...

All features had to fit into a single planar SoC ... on advanced packaging and chiplets at the leading edge of design. This, in turn, has opened the door once again for purely analog/RF functionality ...