EnSilica, a maker of mixed signal ASICs, has announced that it has established a new engineering hub in Cambridge, UK.

Research suggests that the rapid growth in XR content consumption is set to put a major strain on existing networks.

Rhopoint Components is now stocking the Cissoid CMT-PLA3SB12340A Silicon Carbide (SiC) MOSFET Intelligent Power Module.

NXP Semiconductors announces the NTAG X DNA, a new Type 4 secure connected NFC tag, enabling secure authentication.

TSMC has announced that it will be establishing its first European Design Centre (EUDC) in Munich later this year.

TI's technologies will help enable NVIDIA’s 800V DC power-distribution systems for next-generation AI data centres.

SCI Semiconductor raises £2.5m towards developing its security-enhanced MCU based on CHERI, a memory securing framework.

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

At last year’s IEDM, imec reported a breakthrough in the hetero-integration of InP chiplets on a 300mm RF Si interposer, at ...

CEO, Van den hove believes future chips will see their capabilities merged into building blocks called supercells.

Asahi Kasei, a top PSPI (photosensitive polyimide) supplier to TSMC and Samsung, plans to cut PIMEL shipments.

The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will ...