News

Semiconductor Packaging News2d
Essential Practices for Gold Mitigation of Electronic Components
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. What keeps the data centre industry experts up at ...
Semiconductor Packaging News16d
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
SEMI announced it has partnered with Purdue University to launch an online course series focused on artificial intelligence (AI) and data analysis techniques for the semiconductor ... According to the ...
Semiconductor Packaging News7d
New industrial-grade accelerometer with edge AI and low power for smart sensing
STMicroelectronics has completed certification of its ST4SIM-300 embedded SIM (eSIM) to GSMA SGP.32 eSIM IoT specification. Certification assures interoperability ... The latest STDRIVEG610 and ...
Semiconductor Packaging News7mon
Siemens extends collaboration with TSMC to advance integrated circuit & systems design
Siemens Digital Industries Software announced that it has entered into an agreement to acquire Excellicon. This will bring Excellicon's best-in-class software for the development ... Siemens Digital ...
Semiconductor Packaging News1mon
STMicroelectronics' STM32WBA6 combine extra features and performance with power efficiency
STMicroelectronics has completed certification of its ST4SIM-300 embedded SIM (eSIM) to GSMA SGP.32 eSIM IoT specification. Certification assures interoperability ... The latest STDRIVEG610 and ...
Semiconductor Packaging News2mon
Imec first to demonstrate conductor films on 300mm wafers with lower resistivity than Cu and Ru
Imec and the Feinstein Institutes for Medical Research, introduce a novel method for activating neural tissue using intermittent interferential current stimulation (i²CS). ... Breakthrough ...
Semiconductor Packaging News2mon
Imec demonstrates readiness of the High-NA EUV patterning ecosystem
Imec and the Feinstein Institutes for Medical Research, introduce a novel method for activating neural tissue using intermittent interferential current stimulation (i²CS). ... Breakthrough ...
Semiconductor Packaging News10d
Amkor Converting to Pin-Gate Molding Process to Meet Industry Low Cost Demand
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. During the sintering process, the chip is bonded very ...
Semiconductor Packaging News2mon
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia ... Indium ...
Semiconductor Packaging News8d
Indium Corporation's Jenny Gallery to Present at HiTEC
As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia ... Indium ...
Semiconductor Packaging News8d
Nomination Period for Phil Kaufman Award and Hall of Fame Open Through June 30
SEMICON Southeast Asia (SEA) 2025 officially opened at the Sands Expo and Convention Centre, Marina Bay Sands, Singapore. Marking a historic anniversary, the three-day ... May 19, 2025 SEMI North ...
Semiconductor Packaging News22d
EPOXIBOND EB-106S - Gold Bonding Adhesive
epoxySet supplies adhesives specifically for bonding gold or gold plated substrates. The EB-106S is our most widely used adhesive for such applications. This clear epoxy is ... epoxySet introduces the ...