News

ERS electronic is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access ...
Littelfuse, Inc. highlighted the TLSM Series Tactile Switches for surface-mount technology (SMT). Designed with an exceptional lifespan of up to 2 million cycles, the TLSM ... Littelfuse, Inc.
eco Instruments Inc. announced its received over $35 million of orders for its AP300™ Lithography systems in recent quarters from a wide-range of IDM and OSAT customers. ... Semiconductor Packaging ...
Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA ... Dr. Anirudh Devgan, President ...
SEMI announced support of the Strengthening Essential Manufacturing and Industrial Investment Act (SEMI Investment Act), which clarifies that critical materials suppliers ... The Strategic Materials ...
According to the Q1 2025 Semiconductor Manufacturing Monitor (SMM) Report released by SEMI in collaboration with TechInsights, the global semiconductor manufacturing ... SEMICON Southeast Asia (SEA) ...
The Strategic Materials Conference (SMC) Korea 2025 is set to convene on May 14 at the Suwon Convention Center in Gyeonggi-do, South Korea, bringing together leading experts ... As SEMICON Southeast ...
ASMPT will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at the ASMPT booth 5675 during the OFC 2025 trade event being held April 1-3 ASMPT continues to drive the ...
Heraeus Electronics will exhibit at SEMICON Southeast Asia 2025, spotlighting its sustainable and high-performance solutions for advanced packaging. This year's participation ... Heraeus Electronics ...
After more than 22 years at ZEISS, most recently as the member of the Executive Board of Carl Zeiss AG responsible for the Medical Technology segment, Dr. Markus Weber ... The President and CEO of ...
This paper explores how precision motion systems enable key semiconductor manufacturing trends—such as node scaling, advanced packaging, and photonic integration—by delivering the accuracy required ...