Atum Works claims its nanoscale 3D printing technology can cut chip production costs by 90% by replacing traditional ...

Soaring demand for AI servers has propelled Taiwan's ABF substrate leaders—Unimicron Technology, Kinsus Interconnect ...

Computing accelerators grow more complex with multi-chip designs. TSMC plans to stack logic chips while integrating power ...

The newly announced A14 node is planned for 2028. Compared with its upcoming N2 process (set for later this year), TSMC says ...

A NoC provides a structured and scalable approach to transporting data between the growing number of IP blocks in a chip.

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

Good morning, tech fam; here are some quick tech updates for you to catch on to! What’s New Today: TSMC revealed a new chip ...

Discover key insights from MaxLinear's Q1 2025 earnings call. Learn about revenue growth, innovative product launches, and market recovery strategies.

We're creeping up on the five-year anniversary of Tim Cook's Apple Silicon announcement, and over a decade of rumors. Here's ...

Known as co-packaged copper (CPC), or co-packaged cables in some circles, the basic idea is to take a copper cable straight ...

Taichi has demonstrated high efficiency and complex AI task handling, using a novel hybrid optical approach to overcome ...