The etching and characterization room contains a suite of tools for dry etching and characterization of samples ... silicon and descumming samples before metal deposition. It can process wafers up to ...

Dry etching methods are all anisotropic processes ... This can become a problem; if the process is not tightly controlled, the etching reactions can extend underneath the resist layer masking ...

It fits under both the wet and dry etch categories. In all cases, the goal is to perform precise etches with good uniformities on the wafer. Sputter or ion beam etch is a physical process. In ...

(Image: A*STAR Institute of Materials Research and Engineering) Wet etching can be classified into two main types based on the etching mechanism and the resulting profile: It's worth noting that wet ...

These modules are ideal for research and production customers, providing a controlled environment that enhances process repeatability with load-lock and cassette-to-cassette options. Reactive Ion Etch ...