Exhibiting a low mated height of 4.35mm, the Si-Fly LP (low profile) cable-to-board assemblies have been released by Samtec ...

The EasyPACK CoolGaN module integrates 650 V CoolGaN power semiconductors with low parasitic inductances, achieved through ...

The Thermal Master P2 Camera makes snapping thermal images a breeze. Learn how to use it and whether it measures up in this ...

Business cards are a simple way to share contact information, but a memorable design can make them stand out. [Jeremy Cook] ...

Why low-side current sensing is still widely used. Why a precision preamplifier is critical to low-side current-sensing ...

The core problem inherent in routing 448G channels in PCBs is in the via transitions used in BGA escape routing, as well as ...

A group of students from Lancing College in the UK have sent in their Critical Design Review (CDR) for their entry in the UK ...

A manufacturer’s perspective on determining parts layout.

Essentially, an overt focus on performance and product features can lead to a drop in assembly efficiency. Those production ...

Asahi Kasei Microdevices (AKM) and Silicon Austria Labs (SAL) have completed a joint proof of concept for integrating a ...

Samtec’s Si-Fly low-profile cable assemblies provide several mounting options in data center, HPC, and AI applications.