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IEEE Spectrum on MSN19h
Intel Upgrades Chip Packaging for Bigger AI
This week at the IEEE Electronic Components and Packaging Technology Conference, Intel unveiled that it is developing new ...
CIE – Components in Electronics41m
New ZVU series for Panasonic’s range of hybrid caps
Panasonic Industry Europe has launched the ZVU Series Hybrid Capacitors, a solution tailored to meet the escalating demands ...
Megha deal: Krishna Reddy plans Rs 15,000 crore buyout of uncle PP Reddy’s 51% stake
Megha Engineering's shareholders, the Reddy duo, are finalizing a family settlement where PV Krishna Reddy will acquire ...