Legislation is being prepared in the US Congress that would require verification of the final destination of AI chips.

Qt Group will also continue to invest into AI features that make software development more productive. The Qt AI Assistant, ...

Eyeo raises €15m to fund colour-splitting photonics technology, unlocking picture quality and colour accuracy.

NXP Semiconductors has unveiled its new S32R47 imaging radar processors in 16nm FinFET technology. The third generation of imaging radar processors has been designed to deliver up to twice the ...

Power Integrations’ 1700 V-rated SiC-based CV/CC InnoSwitch3-AQ switching power supply ICs deliver up to 120 watts of output ...

SemiQ has announced the expansion of its Gen3 SiC MOSFET offering, launching a 1200 V TSPAK-packaged series. The four-strong ...

Aimed at installed applications such as wall sockets, desks, and furniture, these ultra-compact and fully assembled modules achieve, what the company claims, is the world’s lowest operating ...

Silicon carbide (SiC) has become a cornerstone for enhancing efficiency and supporting decarbonisation across industries.

Keysight is collaborating with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology.

Intel has revealed that several of its contract manufacturing customers are planning to build test chips for a forthcoming ...

Codasip has made available an exploration platform based on the Codasip X730 application core, which integrates CHERI.

CELUS, the developer of an AI-assisted electronics design platform, has announced the integration of its CELUS Design ...