News

Semiconductor Packaging News5d
Essential Practices for Gold Mitigation of Electronic Components
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. The unique Revolving Measurement Unit (RMU) houses up ...
Semiconductor Packaging News1mon
Introducing First 2kA ProtectionThyristor in Compact DO-214AB Package from Littelfuse
Littelfuse, Inc. announced the release of the IXD0579M high-speed gate driver IC. The IXD0579M simplifies board design, saves space, and offers a reliable, multiple-source ... Littelfuse, Inc.
Semiconductor Packaging News10d
STMicroelectronics unveils next-generation automotive NFC readers
STMicroelectronics has completed certification of its ST4SIM-300 embedded SIM (eSIM) to GSMA SGP.32 eSIM IoT specification. Certification assures interoperability ... The latest STDRIVEG610 and ...
Semiconductor Packaging News19d
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
SEMI announced it has partnered with Purdue University to launch an online course series focused on artificial intelligence (AI) and data analysis techniques for the semiconductor ... According to the ...
Semiconductor Packaging News10d
New industrial-grade accelerometer with edge AI and low power for smart sensing
STMicroelectronics has completed certification of its ST4SIM-300 embedded SIM (eSIM) to GSMA SGP.32 eSIM IoT specification. Certification assures interoperability ... The latest STDRIVEG610 and ...
Semiconductor Packaging News8mon
Siemens extends collaboration with TSMC to advance integrated circuit & systems design
Siemens Digital Industries Software announced that it has entered into an agreement to acquire Excellicon. This will bring Excellicon's best-in-class software for the development ... Siemens Digital ...
Semiconductor Packaging News13d
Amkor Converting to Pin-Gate Molding Process to Meet Industry Low Cost Demand
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. During the sintering process, the chip is bonded very ...
Semiconductor Packaging News1mon
STMicroelectronics' STM32WBA6 combine extra features and performance with power efficiency
STMicroelectronics has completed certification of its ST4SIM-300 embedded SIM (eSIM) to GSMA SGP.32 eSIM IoT specification. Certification assures interoperability ... The latest STDRIVEG610 and ...
Semiconductor Packaging News2mon
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia ... Indium ...
Semiconductor Packaging News11d
Nomination Period for Phil Kaufman Award and Hall of Fame Open Through June 30
SEMICON Southeast Asia (SEA) 2025 officially opened at the Sands Expo and Convention Centre, Marina Bay Sands, Singapore. Marking a historic anniversary, the three-day ... May 19, 2025 SEMI North ...
Semiconductor Packaging News1mon
OMNIVISION Launches 1.5-Megapixel Global Shutter Sensor
OMNIVISION announced the new OX01N1B image sensor for in-cabin automotive driver monitoring systems (DMS). The device is the newest addition to OMNIVISION's ...
Semiconductor Packaging News21d
Veeco Announces Over $35 Million in Advanced Packaging Lithography System Orders
eco Instruments Inc. announced its received over $35 million of orders for its AP300™ Lithography systems in recent quarters from a wide-range of IDM and OSAT customers. ... Semiconductor Packaging ...